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Helion Signs Letter of Intent for $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D to Support Fusion Energy

来源：Business Wire · 美国 19 小时前

Helion, a Washington-based fusion energy company, announced today it has signed a letter of intent with the U.S. Department of Commerce to receive up to ...

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Helion Signs Letter of Intent for $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D to Support Fusion Energy

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Helion Signs Letter of Intent for $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D to Support Fusion Energy

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